Brand Name : FOTMA
Model Number : MoCu
Certification : ISO9001:2008
Place of Origin : P.R. China
MOQ : 1 pcs
Price : Negotiable
Payment Terms : T/T, L/C, Western Union, PayPal
Supply Ability : 10000pcs/month
Delivery Time : 20-25 days after deposit
Packaging Details : Paper cartons or plywood boxes
Molybdenum Copper Heat Sink Electronic Packaging Materials
Heat Sink Description:
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Heat Sink Advantages:
1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
Heat Sink Product Properties:
Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Heat Sink Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
70MoCu 60MoCu 50MoCu Molybdenum Copper Heat Sink Electronic Packaging Materials Images |