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Hubei Fotma Machinery Co., Ltd. Tungsten, Molybdenum, Titanium, Tungsten Carbide and Investment Casting Products
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70MoCu 60MoCu 50MoCu Molybdenum Copper Heat Sink Electronic Packaging Materials

Hubei Fotma Machinery Co., Ltd.

70MoCu 60MoCu 50MoCu Molybdenum Copper Heat Sink Electronic Packaging Materials

Brand Name : FOTMA

Model Number : MoCu

Certification : ISO9001:2008

Place of Origin : P.R. China

MOQ : 1 pcs

Price : Negotiable

Payment Terms : T/T, L/C, Western Union, PayPal

Supply Ability : 10000pcs/month

Delivery Time : 20-25 days after deposit

Packaging Details : Paper cartons or plywood boxes

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Molybdenum Copper Heat Sink Electronic Packaging Materials

Heat Sink Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Heat Sink Advantages:

1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.

Heat Sink Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Heat Sink Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

70MoCu 60MoCu 50MoCu Molybdenum Copper Heat Sink Electronic Packaging Materials


Product Tags:

50MoCu Molybdenum Copper Heat Sink

      

60MoCu Molybdenum Copper Heat Sink

      

70MoCu Molybdenum Copper Heat Sink

      
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